Tungsten-copper (WCu) electronic packaging material possesses the desirable characteristics of low expansion from tungsten and high thermal conductivity from copper. One of its valuable features is the ability to adjust the material’s coefficient of thermal expansion, thermal conductivity, and electrical conductivity by modifying its composition, thus enabling versatile applications.
Our company utilizes high-purity and premium-quality raw materials. Through processes such as pressing, forming, high-temperature sintering, and fusion infiltration, we produce WCu electronic packaging materials and heat sink materials that exhibit exceptional performance.
Advantages of tungsten copper (WCu) electronic packaging materials:
- Adjustable coefficient of thermal expansion allows for compatibility with various substrates, including stainless steel, valveable alloys, silicon, gallium arsenide, gallium nitride, aluminum oxide, and more.
- Maintains good thermal conductivity without the need for additional sintering activation elements.
- Low porosity and excellent air tightness of the final product.
- Precise dimensional control, superior surface finish, and flatness.
- Provides options such as sheets and molded parts, and can also meet specific plating requirements.
WCu Performance:
|
Brand |
WCu content |
WCu Density |
WCu Coefficient of thermal expansion |
WCu Thermal conductivity |
|
90WCu |
90±2% |
17.0 |
6.5 |
180 (25℃) /176 (100℃) |
|
85WCu |
85±2% |
16.4 |
7.2 |
190 (25℃)/ 183 (100℃) |
|
80WCu |
80±2% |
15.65 |
8.3 |
200 (25℃) / 197 (100℃) |
|
75WCu |
75±2% |
14.9 |
9.0 |
230 (25℃) / 220 (100℃) |
|
50WCu |
50±2% |
12.2 |
12.5 |
340 (25℃) / 310 (100℃) |
Applications:
Materials suitable for packaging with high-power devices, such as substrates and lower electrodes; high-performance lead frames; thermal control panels and heat sinks for military and civilian thermal control devices, etc.
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