Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density,which makes it a great alternative to tungsten copper for weight sensitive applications.
Features:
High thermal conductivity due to no sintering additives was used;
Excellent hermeticity;
Relatively small density;
Stampable sheets available (Mo content not more than 75wt%)
Semi-finished or finished (Ni/Au/Ag plated) parts available
Physical Properties:
Physical Properties:
Application:
These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.
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