CU+CO+CU+CU(CPC base provider)

Similar to CU+Mo+Cu (CMC), CU+CO+CU+CU(CPC) is also a sandwich structure, which is composed of two sub-layers – copper (Cu) wrapped around a core layer – molybdenum-copper alloy (MoCu), which has a different coefficient of thermal expansion in the X region and Y region, compared to tungsten copper, molybdenum copper and copper/molybdenum/copper materials, copper-molybdenum-copper-copper (Cu/MoCu/Cu) has a higher thermal conductivity and a relative price advantage.

Advantages of CU+CO+CU+CU(CPC) electronic packaging materials:

• 1. higher thermal conductivity than CMC
• 2. can be stamped into parts, reducing costs
• 3. strong interface bonding, can repeatedly withstand 850 ℃ high temperature shock
• 4. Designable coefficient of thermal expansion, compatible with materials such as semiconductors and ceramics
• 5. Non-magnetic

Applications:

Having a designable coefficient of thermal expansion and thermal conductivity, copper/molybdenum copper/copper (CPC) is used as substrates and flanges for RF, microwave and semiconductor high-power devices.

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