CU+Mo+Cu (CMC)encapsulation material is a sandwich structured flat composite material that uses pure molybdenum as the core material and is then covered on both sides with pure copper or dispersion-reinforced copper.
This material has an adjustable coefficient of thermal expansion, high thermal conductivity and excellent high temperature resistance. The production process is generally prepared by rolling lamination, electroplating lamination, explosion forming and other processing methods. Mainly used as heat sink, lead frame and multilayer printed circuit board (PCB) bottom expansion and thermal conductivity channel.
|
Type |
Material |
Density |
Thermal conductivity |
Coefficient of thermal expansion |
|
CopperMetallaminate |
1:1:1 |
9.32 |
305(xy)/250(z) |
8.8 |
|
1:2:1 |
9.54 |
260(xy)/210(z) |
7.8 |
|
|
1:3:1 |
9.66 |
244(xy)/190(z) |
6.8 |
|
|
1:4:1 |
9.75 |
220(xy)/180(z) |
6 |
|
|
13:74:13 |
9.88 |
200(xy)/170(z) |
5.6 |
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