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Tungsten-copper (WCu) electronic packaging material possesses the desirable characteristics of low expansion from tungsten and high thermal conductivity from copper. One of its valuable features is the ability to adjust the material’s coefficient of thermal expansion, thermal conductivity, and electrical conductivity by modifying its

Molybdenum-copper is a composite material consisting of molybdenum and copper. It possesses properties similar to tungsten-copper and offers adjustable coefficients of thermal expansion and thermal conductivity. However, molybdenum-copper has a lower density compared to tungsten-copper, making it more suitable for aerospace and other applications.